Improvement by Channel Recess of Contact Resistance and Gate Control in Large-Scale Spin-Coated MoS2 MOSFETs

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Solution-processed 2-D materials, being low temperature, low cost, and scalable, are attractive for future-generation thin-film and flexible transistors. However, it is challenging to dispense solution-processed 2-D material into a thin and continuous channel for effective and uniform gate control. In addition, a thick channel under the source and drain contacts is required to increase the transfer length and decrease the edge contact resistance. To overcome such a dilemma and to obtain the optimum combination of effective gate control and low contact resistance, channel recess was demonstrated for the first time on MoS2, so that the channel is thin in the gate region but thick in the source and drain regions. Specifically, channel recess by CHF3/O2 dry etching up to 60 s was performed on submicron buried-gate MOSFETs fabricated on 20-nm-thick spin-coated MoS2. It was found that the channel recess improved the current on/off ratio by 3 orders of magnitude while maintaining approximately the same contact resistance and peak transconductance as that of a uniformly 20-nm-thick channel. The resulted performance was among the best of all solution-processed MoS2 MOSFETs. The same channel recess technique can be used to improve the performance of MOSFETs made of other solution-processed 2-D materials.