Abstract
The bond pad design on a chip can be reconfigured to a new pad design using a redistribution layer, based on multichip module-deposited (MCM-D) technology. The new pad configuration can be used for flip chip mounting. The thermo-mechanical reliability of these redistributed flip chip structures is in particular determined by the visco-plastic deformations of the solder joints and by the stresses in the photosensitive BCB redistribution layers. In this paper, the influence of this redistribution layer on the solder joint reliability is investigated. Also the induced stresses in this redistribution layer may not exceed the ultimate stress level. Three different redistribution processes are considered. Finite element simulations and Coffin-Manson based reliability models are used to compare the thermal cycling reliability of redistributed and standard flip chip assemblies. The existence of a photosensitive BCB redistribution layer on the chip influences the thermal fatigue of solder joints. The largest reliability improvement using redistributed chips is achieved by moving the solder joints from the perimeter to the interior of the die resulting in an area array flip chip.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
