Abstract
AbstractIn this paper, highly electrically and thermally conductive copper powders (Cu) and electrically insulative yet thermally conductive silicon carbide whiskers (SiCw) were selected as functional fillers and high‐density polyethylene (HDPE) was used as the matrix to prepare thermal conductive composites. By controlling the amount of Cu at 30 vol% which is below percolation threshold, the volume resistivity of the composites is maintained above 1014 Ω cm. The results showed that SiCws entered the area which was not occupied by Cu particles and they played a bridging effect among Cu particles, thereby promoting the formation of intact thermal conductive pathways that contributed to improving the thermal conductivity of corresponding composites. The combination of SiCw:Cu = 3:1 at a filler content of 30 vol% resulted in a thermal conductivity as high as 1.921 W/mK, which is 380% higher than pure HDPE.
Published Version
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