Abstract
In this work, the impact of fluorine (CF4) and oxygen (O2) plasma passivation on HfZrOx (HZO) based ferroelectric capacitor was investigated. By the fluorine passivation, the surface trap density and oxygen vacancies in the HZO-based Metal–ferroelectric–insulator–semiconductor (MFIS) capacitors were suppressed, resulting in the increased pristine remnant polarization (2Pr). The pristine value (2Pr) of baseline samples annealed at 500 °C and 600 °C were 11.4 µC/cm2 and 24.4 µC/cm2, respectively. However, with the F–passivation, the 2Pr values were increased to 30.8 µC/cm2 and 48.2 µC/cm2 for 500 °C and 600 °C, respectively. The amount of surface defects and oxygen vacancies are quantitatively confirmed by the conductance method and XPS analysis. However, due to the incorporation of fluorine atoms into the ferroelectric–insulator films, undesirable degradation on endurance characteristics were observed.
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