Improved Plating of Small Holes and other Benefits found using “Pulse Plating” of Acid Copper in PCB Manufacture

Abstract

SummaryTrials have been carried out over the last year in the manufacture of Printed Circuit Boards (PCB) using Schlötter PC81 Acid Copper in Pulse mode. The trials monitored the performance of the chemistry under prolonged pulse conditions, the reliability of the Pulse Rectification units, as well as evaluating the benefits of the process to the PCB manufacturer. It may be concluded from the trials that there are considerable benefits to be derived from the procedure.These benefits are: 1) A reduction in average plating time by 30% to 50%.2) 1:1 or better hole to surface copper distribution.3) A reduction in average track height of 50%.