Abstract
Problem statement: This research attempts to optimize the parameters for pulse plating of silver on printed circuit board. The idea here is to use pulse plating technique which is metal deposition by pulsed electrolysis method. Approach: Printed Circuit Boards (PCB) plays a major role in all communication and electronics industry. Silver is a ductile and malleable metal which has 7% higher conductivity than copper. Here the electro deposit is influenced by current density, silver concentration in the bath, applied current type. Pulse plating technique is used in double sided printed circuit board especially in the case of plated through hole technique. Here exist a necessity to do plating which will deposit a metal wall in the substrate and it will connect between the components. Results: This method of pulse plating proves that it avoids the disadvantage of rough deposition that is caused due to DC plating in PCB's. Conclusion: The surface morphology and the grain size is measured using XRD analysis and it proves that the number of pin holes is reduced.
Highlights
The Printed circuit market is expanding at a dramatic rate over few years
Pulse plating is similar to dc plating but it has a square wave current along with a periodic reverse current
Plating is better for printed circuit boards and the parameters are optimized for pulse plating
Summary
Manufacturers are exploring new technologies in the manufacturing of printed circuit boards. After the formation of holes the most important step is metallization (Bosshart, 1983). The plating process is one of the most critical steps in the high end PCB manufacturing process (Nelissen et al, 2005). Copper is the most conventional type of metal used for plating in PCB industry. In PCB industry DC plating is the most widely used technique. DC currents will be used to deposit copper on the substrate. The phenomenon of non-even copper distribution in holes is called “Dogboning” (Yung and Romankiw, 1989). In practical terms low direct current is the other way of achieving good distribution but the plating cycle time would be increased (Yung et al, 2003). When a pulse plating technique is used it reduces number of pin holes.
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