Abstract
This improved monitoring protocol, with its simple experimental design and four methods of analysis, allows for a more complete picture of corrosion processes and inferences about scale buildup.The effect of orthophosphate addition (1 mg/L as P) on copper and lead–tin solder corrosion was monitored using an experimental coupon exposure apparatus with measurement by standing water metals analysis, gravimetric analysis, direct galvanic current metering, and potentiodynamic scan analysis. Orthophosphate addition appeared to have a significant effect on lead–tin solder corrosion although the results of each analysis differed in magnitude. The effect of orthophosphate addition on copper corrosion was less clear with gravimetric analysis showing a significant effect, whereas metals release analysis showed only a slight effect.
Published Version
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