Abstract
A new type of lead-free composite solder has been prepared by adding Mo nanoparticles in Sn3.0Ag0.5Cu solder. Tensile strength tests were conducted on Sn3.0Ag0.5Cu/Cu joint and composite solder/Cu joints. The results indicated that the addition of Mo nanoparticles markedly improved the tensile strength of solder joint. when Mo concentration was between 0 and 1%, with the increase of Mo concentration, the tensile strength increased significantly. EBSD (Electron Back Scatter Diffraction) analysis of microstructure was conducted. It was concluded that Mo could significantly increase grain boundary length and dislocation density, reduce the size of the β-Sn phase.
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