Abstract
We report a contact engineering method to minimize the Schottky barrier height (SBH) and contact resistivity of MoS2 field-effect transistors (FETs) by using ultrathin 2D semiconductors as contact interlayers. We demonstrate that the addition of a few-layer MoSe2 between the MoS2 channel and Ti electrodes effectively reduces the SBH at the contacts from ∼100 to ∼25 meV, contact resistivity from ∼6 × 10-5 to ∼1 × 10-6 Ω cm2, and current transfer length from ∼425 to ∼60 nm. The drastic reduction of SBH can be attributed to the synergy of Fermi-level pinning close to the conduction band edge of the MoSe2 interlayer and favorable conduction-band offset between the MoSe2 interlayer and MoS2 channel. As a result of the improved contacts, MoS2 FETs with Ti/MoSe2 contacts also demonstrate higher two-terminal mobility.
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