Abstract
The study of the electrical properties of materials at cryogenic temperature is significant for the design of insulation structures of superconducting equipment. Here, epoxy resin was combined with a small amount of KH650 modified SiC nanoparticles. When the dosage of SiC nanoparticles increased from 0.1% to 0.3%, the DC breakdown strength of the composite increase from 83.93 kV/mm to 97.51 kV/mm at room temperature and from 90 kV/mm to 120 kV/mm at 77 K. Furthermore, we used differential scanning calorimeter (DSC) and dynamic thermomechanical analysis (DMA) to analyze the effect of low-content SiC nanoparticles on the thermal behavior of epoxy resin.
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