Improved ABS plastic activating treatment for electroless copper plating

Abstract

A new method is described for the electroless deposition of copper onto acrylonitrile—butadiene—styrene (ABS) plastic. Etched ABS plastic was dipped directly into PdSO 4 solution instead of the usual sensitization followed by activation. Experimental results show that the Pd 2+ ions from PdSO 4 solution are coordinated to the polar groups (i.e. COOH, SO 3H—, etc.) on the surface of the etched ABS, resulting in the formation of ABSPd 2+ complex. In an electroless copper bath containing a formaldehyde (HCHO) reducing agent, the ABSPd 2+ complex is reduced to product Pd 0 atoms, which then act as catalysts and initiate the deposition of copper metal. Initially, the copper deposition rate was slow; however, it rose to that for conventional methods in about 10 min.