Abstract
AbstractA new method is described for the electroless deposition of copper onto glass. Commercially available glass slide was modified with μ‐amimopropyltrimethoxysilane to form self‐assembled monolayer (SAM) on it. Then it was dipped directly into PdCl2 solution instead of the conventional SnCl2 sensitization followed by PdCl2 activation. Experimental results showed that the Pd2+ ions from PdCl2 solution were coordinated to the ammo groups on the glass surface resulting in the formation of N—Pd complex. In an electroless copper bath containing a formaldehyde reducing agent, the N—Pd complexes were reduced to Pd0 atoms, which then acted as catalysts and initiated the deposition of copper metal. Although the copper deposition rate on SAM‐modified glass was slow at the beginning, it reached to that of conventional method in about 5 min.
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