Abstract
As-imprinted right-edged pillar structures were reconfigured into a tapered sidewall profile by CHF3-based reactive ion etch. The transmittance spectra improved as the sidewall became more tapered for longer etch times. The effect was most distinctive (28.4%) in the transmittance trench zone at wavelengths from 460 to 470 nm owing to the reduced diffraction scattering loss. The transmittance enhancement for silver-coated corrugated nanostructures was even greater (57.0%) for a tapered sidewall structure, in close agreement with the predictions of simulations. The infrared transmittance was notably reduced compared with that in the UV–visible zone, suggesting the possible applications of the structures in heat-insulated windows.
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