Abstract
The influence of various electrolysis parameters, such as the type of cathode, composition of the electrolyte and electrolysis time, on the morphology, structure and hardness of copper coatings has been investigated. Morphology and structure of the coatings were analyzed by scanning electron microscope (SEM), atomic force microscope (AFM) and X-ray diffraction (XRD), while coating hardness was examined by Vickers microindentation test applying the Chicot–Lesage (C–L) composite hardness model. Depending on the conditions of electrolysis, two types of Cu coatings were obtained: fine-grained mat coatings with a strong (220) preferred orientation from the sulfate electrolyte and smooth mirror bright coatings with a strong (200) preferred orientation from the electrolyte with added leveling/brightening additives. The mat coatings showed larger both measured composite and calculated coating hardness than the mirror bright coatings, that can be explained by the phenomena on boundary among grains. Independent of electrolysis conditions, the critical relative indentation depth (RID) of 0.14 was established for all types of the Cu coatings, separating the zone in which the composite hardness can be equaled with the coating hardness and the zone requiring an application of the C–L model for a determination of the absolute hardness of the Cu coatings.
Highlights
Copper is widely used in many industrial branches involving aerospace, automotive, electronics and telecommunications [1]
Electrodeposition of copper was performed by a galvanostatic regime of electrolysis (DC mode) at a current density (j) of 50 mA cm−2 from the acid sulfate electrolyte and from an electrolyte with addition of leveling and brightening additives that enable a formation of Cu coatings with mirror bright appearance [23,24]
Composite hardness model was used for a determination of the absolute hardness of the composite hardness model was used for a determination of the absolute hardness of the
Summary
Copper is widely used in many industrial branches involving aerospace, automotive, electronics and telecommunications [1] Its application in these industries is due to the specific characteristics of this metal, such as high thermal and electrical conductivity, malleability, corrosion resistance and good adhesion with a substrate. Various methods, such as electrodeposition, electroless plating, chemical vapor deposition (CVD), physical vapor deposition (PVD), thermal spray and sputtering techniques, are the most often used for obtaining Cu in a compact form on different conductive or non-conductive substrates [2,3]. The largest lack of pulse reverse regimes for massive use is high cost of pulse rectifiers, which is considerably higher than the DC units [6]
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