Abstract

By statistically analyzing 28,800 cells of arrayed stacked gate transistors, for the first time, we examine the effectiveness of nitric oxide (NO) and nitrous oxide (N2O) nitridation in the suppression of the microscopic stress-induced leakage current (mSILC) observed in devices on the order of square microns in size. We have found that NO nitridation is more effective in suppressing the mSILC than N2O nitridation and is very promising for the reduction of bit failures. The difference between the SILC observed in devices on the order of square millimeters in size and the mSILC observed in devices on the order of square microns in size is also discussed.

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