Impact of distributed gate resistance on the performance of MOS devices

Abstract

This paper describes the impact of gate resistance on cut-off frequency (f/sub T/), maximum frequency of oscillation (f/sub max/), thermal noise, and time response of wide MOS devices with deep submicron channel lengths. The value of f/sub T/ is proven to be independent of gate resistance even for distributed structures. An exact relation for f/sub max/ is derived and it is shown that, to predict f/sub max/, thermal noise, and time response, the distributed gate resistance can be divided by a factor of 3 and lumped into a single resistor in series with the gate terminal. >