Abstract
PurposeThis paper aims to develop thermal analysis method of thermal joints characterization. The impact on convection on thermal resistance analysis with use thermography for silver-based thermal joints were investigated for non-metallized and metalized semiconductor surfaces. Heat transfer efficiency depends on thermal conductivity; radiation was used to perform thermographic analysis; the convection is energy loss, so its removing might improve measurements accuracy.Design/methodology/approachInvestigation of thermal joints analysis method was focused on determination of convection impact on thermal resistance thermographic analysis method. Measuring samples placed in vacuum chamber with lowered pressure requires transparent window for infrared radiation that is used for thermographic analysis. Impact of infrared window and convection on temperature measurements and thermal resistance were referred.FindingsThe results showed that the silicon window allowed to perform thermal analysis through, and the convection was heat transfer mode which create 15% energy loss.Originality/valueIt is possible to measure thermal resistance for silver-based thermal joints with convection eliminated to improve measurements accuracy.
Highlights
Modern trends in electronic industry, mainly miniaturization with simultaneous faster operation speed of electronic devices are causing larger amount of heat generation than in the past
We propose the direct measurement by using the thermography method
Electrical power was supplied via printed circuit board, where interconnection was done by electrically conductive adhesive
Summary
Modern trends in electronic industry, mainly miniaturization with simultaneous faster operation speed of electronic devices are causing larger amount of heat generation than in the past. Heat dissipation becomes crucial, where both technology and used material will ensure high conductivity thermal joints with simultaneous acceptable mechanical strength. The mechanism of heat removal is made by using high thermal conductive layer as a filler between surfaces of heat generating element (heat source) and a proper substrate (might be a heat spreader). Their role is to fill micro-sized gaps which leads to thermal resistance decrease of such joint and heat transfer efficiency improvement. There is no doubt that bulk silver is a highly conductive material ($429 W/mK); sintered layer cannot be treated as bulk silver and its thermal conductivity has to be measured. The purpose of this work is to assess the impact of this phenomenon on the accuracy of the measurement method used
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