Abstract

The impact of surface orientations on electrical characteristics of Ge pand n-channel MOSFETs with ultrathin equivalent oxide thickness Al <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> O <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sub> /GeOx/Ge gate-stacks is systematically investigated. It is found that (100), (110), and (111) GeOx/p-Ge metal-oxide-semiconductor (MOS) interfaces have a similar interface trap density (D <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">it</sub> ) level, but (100) GeO <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">x</sub> /n-Ge MOS interfaces exhibit the lowest D <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">it</sub> . As a result, the highest peak mobility is obtained in (110) Ge pMOSFETs for holes and in (100) Ge nMOSFETs for electrons. The higher interface state density is observed inside valence band of Ge for (110) GeO <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">x</sub> /Ge MOS interface and inside conduction band of Ge for (110) and (111) GeO <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">x</sub> /Ge MOS interfaces, leading to the significant effective mobility reduction in high normal field for (110) Ge pMOSFETs, and (110) and (111) Ge nMOSFETs. It is also confirmed that decrease of plasma oxidation temperature is also effective in reduction of the interface roughness at (100) to (111) GeO <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">x</sub> /Ge interfaces, resulting in clear enhancement of both hole and electron mobility in high normal field region.

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