Abstract
A clear poly(amic acid) was reinforced by a trisilanolphenyl polyhedral oligomeric silsesquioxane (POSS) by direct dissolution, and transparent silicon-reinforced polyimide (Si-RPI) films with different POSS loadings were obtained after curing, showing high transmittance of >90% within 380–800 nm. The Si-RPI films were exposed to a ground hyperthermal atomic oxygen (AO) beam. The erosion depths and derived erosion yields of the materials decreased with POSS loadings. At a 20 wt% POSS loading, the Si-RPI showed an erosion yield of 0.13 × 10−24 cm3 atom−1 at a fluence of 2.79 × 1020 O atoms cm−2. Surface morphology and element composition characterization on Si-RPI indicated that SiOx-based passivating layers were formed on surfaces upon the hyperthermal AO attack. This study suggests a facile way of reinforcing Si into transparent polyimide for a promising candidate of spacecraft coating material operating in low Earth orbit.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
