Hygrothermal Properties of Epoxy Film Adhesives

Abstract

Abstract The hygrothermal response of high performance epoxy film adhesives, in their bulk state, has been characterized over a wide range of temperatures, following exposure to a combination of humidity (95% R.H.) and heat (50°C). Experimental results have indicated that the testing temperature has a pronounced effect on both tensile modulus and strength of the adhesives, while the effect of moisture content varies with respect to the adhesive type. The moduli of the film adhesives, which have a wide range of glass transition temperatures (Tg ), have been related to both moisture level in the adhesive and testing temperature. This has been accomplished by employing a dimensionless temperature, which incorporates the wet and dry Tg and the testing, as well as a reference, temperature. The strength properties have shown a higher degree of scatter using the abovementioned dimensionless temperature. Scanning electron microscopy of the fracture surfaces have shown a good agreement between the effects of moisture and the mechanical properties. Adhesives which exhibited good moisture resistance, as manifested by the stability in their tensile properties, showed minor changes in their fracture surfaces regardless of moisture conditioning. Distinctively, the effect on strength properties has been correlated with typical moisture-induced fracture mechanisms.