Abstract

The fabrication of a single-crystal hydrogen-terminated diamond metal-oxide-semiconductor field-effect transistor (MOSFET) with HfSiON/Al2O3 bilayer dielectric has been carried out. HfSiON and Al2O3 layers were deposited by sputtering-deposition (SD) and atomic layer deposition (ALD) techniques. The maximum output current for SD-HfSiON/ALD-Al2O3 was 36 mA mm−1, and for ALD-Al2O3, it was 31 mA mm−1. We reported that the hysteresis shift voltage of the bilayer dielectric MOSFET was one fourth of the single dielectric layer MOSFET. The leakage current density of SD-HfSiON/ALD-Al2O3 was one order of magnitude lower than the single layer dielectric. We also determined the dielectric constants of HfSiON/Al2O3 and Al2O3 dielectrics based on capacitance–voltage characteristics. The values of VTH, on/off ratio, subthreshold swing, and low field mobility for the bilayer dielectric MOSFET were evaluated to be 4.5 V, 105, 296 mV/decade, and 154 cm2 V−1 s−1, respectively.

Highlights

  • Diamond semiconductor has exceptional physical and electrical properties along with wide bandgap energy, high breakdown field, high carrier saturation velocity, high carrier mobility, and the highest thermal conductivity

  • FETs are fabricated with high-k oxide insulators; two techniques are commonly used to deposit these high-k insulators: sputtering deposition (SD) and atomic layer deposition (ALD)

  • We demonstrated the fabrication of metal-oxide-semiconductor field-effect transistor (MOSFET) with bilayer SD-HfSiON/Al2O3 layers were deposited layer deposition (ALD)-Al2O3 dielectrics and the electric properties were investigated for the device

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Summary

Introduction

Diamond semiconductor has exceptional physical and electrical properties along with wide bandgap energy, high breakdown field, high carrier saturation velocity, high carrier mobility, and the highest thermal conductivity. The fabrication of a single-crystal hydrogen-terminated diamond metal-oxide-semiconductor field-effect transistor (MOSFET) with The the maximum output current for SD-HfSiON/ALD-Al2O3 hysteresis shift voltage of the bilayer dielectric MOSFET By sputtering-deposition (SD) and atomic was 36 mA mm−1, and for ALD-Al2O3, it was one fourth of the single dielectric layer

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