Hybrid Stacking Integration of Multi-Sensor Navigation Module with WLFO and Thick Film Process

Abstract

A hybrid stacking integration of multi-sensor navigation module with WLFO and thick film process was demonstrated. With wafer level fan-out packaging and stacked LTCC substrates, the GNSS, MEMS IMU, magnetometer and altimeter were integrated in one single module, the MEMS inertial sensors and ASIC chips were overlapping integrated with WLFO process as a multilayer wafer and diced, then the diced MEMS-ASIC modules, as well as the accessory circuits were pattered and mounted on several LTCC substrates as a drawer structure to accomplish the final system. The size of inertial sensor module is 10mm×5mm, and the entire navigation module is with size of 26.7cm3 and weight of 36g, meanwhile, with a high performance, the multi-sensor module can achieve low cost and high performance simultaneously. This module can be utilized for reliable navigation and gesture perception of micro UAV/UUV, automotive and other minimized platforms.