Abstract
To fulfill the functionality demands from the fast developing optical networks, a hybrid integration approach allows for combining the advantages of various material platforms. We have established a polymer-based hybrid integration platform (polyboard), which provides flexible optical input/ouptut interfaces (I/Os) that allow robust coupling of indium phosphide (InP)-based active components, passive insertion of thin-film-based optical elements, and on-chip attachment of optical fibers. This work reviews the recent progress of our polyboard platform. On the fundamental level, multi-core waveguides and polymer/silicon nitride heterogeneous waveguides have been fabricated, broadening device design possibilities and enabling 3D photonic integration. Furthermore, 40-channel optical line terminals and compact, bi-directional optical network units have been developed as highly functional, low-cost devices for the wavelength division multiplexed passive optical network. On a larger scale, thermo-optic elements, thin-film elements and an InP gain chip have been integrated on the polyboard to realize a colorless, dual-polarization optical 90° hybrid as the frontend of a coherent receiver. For high-end applications, a wavelength tunable 100Gbaud transmitter module has been demonstrated, manifesting the joint contribution from the polyboard technology, high speed polymer electro-optic modulator, InP driver electronics and ceramic electronic interconnects.
Highlights
Photonic integration endeavors to bring multiple optical functions into a compact device with a small footprint, low power consumption and reliable performance, analogous to electronic integration.contrary to the situation in the electronic industry where silicon CMOS dominates, photonic devices nowadays do not tend to converge to one major material system
The device relies heavily on the hybrid integration technology: the polyboard provides low-loss waveguide components including bends, tapers and multi-mode interference devices (MMIs), as well as thermo-optic components including tunable Bragg gratings and variable optical attenuators (VOAs) [33,34]; the thin-film elements, based on the mixed layers of polymers and dielectrics, are used to split and rotate the polarization states; indium phosphide (InP) photonics platform provides the light source (GC) and the high-speed (100G)
Besides the demonstrated wavelength tunability and polarization management, the polyboard can bring a switching matrix based on thermo-optic switches and enable the multi-flow control of the optical circuits, a function that empowers the software defined network (SDN) directly down to the optical circuit level but is deemed too expensive to be implemented on any other integration platforms
Summary
Photonic integration endeavors to bring multiple optical functions into a compact device with a small footprint, low power consumption and reliable performance, analogous to electronic integration. Filters, and other passive optical functions can be realized in low-cost platforms such as polymer, silica and silicon nitride planar lightwave circuits (PLCs). Hybrid photonic integration allows for selecting individual components from the respective best-suited material platform and for assembling them in a common motherboard. From waveguides to optical assemblies and to packaged modules, details of the heterogeneous/ hybrid integration technology are revealed, uncovering the integration flexibility, scalability, and cost-effectiveness this platform offers. Functionalities such as wavelength tunability and polarization control can be realized in a simple and clean manner, making this platform highly attractive in applications where colorless and polarization-multiplexed operations are required
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