Abstract

Increasing demand for every faster information throughput is driving the emergence of integrated photonic technology. The traditional silicon platform used for integrated electronics cannot provide all of the functionality required for fully integrated photonic circuits, and thus, the last decade has seen a strong increase in research and development of hybrid and heterogeneous photonic integrated circuits. These approaches have enabled record breaking experimental demonstrations, harnessing the most favorable properties of multiple material platforms, while the robustness and reliability of these technologies are suggesting entirely new approaches for precise mass manufacture of integrated circuits with unprecedented variety and flexibility. This Tutorial provides an overview of the motivation behind the integration of different photonic and material platforms. It reviews common hybrid and heterogeneous integration methods and discusses the advantages and shortcomings. This Tutorial also provides an overview of common photonic elements that are integrated in photonic circuits. Finally, an outlook is provided about the future directions of the hybrid/heterogeneous photonic integrated circuits and their applications.

Highlights

  • Integrated circuit technology has underpinned the information revolution, enabling our computers, our smart phones, and the information superhighway that connects us

  • The traditional silicon platform used for integrated electronics cannot provide all of the functionality required for fully integrated photonic circuits, and the last decade has seen a strong increase in research and development of hybrid and heterogeneous photonic integrated circuits

  • The need to overcome this electronic bottleneck has led to the advent of integrated photonics with the aim of providing a direct interface to the vast bandwidth that is currently available with fiber optics

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Summary

INTRODUCTION

Integrated circuit technology has underpinned the information revolution, enabling our computers, our smart phones, and the information superhighway that connects us. Photonic integrated circuits (PICs) are attractive as they can shrink down these rack scale photonic modules to a chip the size of a thumb nail—similar to the integrated electronics that they interface The integration of such systems on a chip comes with additional benefits, such as energy efficiency, robustness, weight reduction, and ultra-fast feedback control. In the laboratory, these properties have enabled unprecedented scientific demonstrations, such as chip-scale optical frequency synthesizers,[1] battery operated optical frequency comb sources,[2] and high-speed optical communication experiments.[3] Industrially, companies, such as Cisco, Juniper, Infinera Corporation, and Huawei,[4] are already offering commercial products using PICs for broadband interfacing of electronics; many are exploring the potential of PICs for more sophisticated information processing functionalities as well.

MATERIAL TECHNOLOGIES
HYBRID AND HETEROGENEOUS INTEGRATION
Hybrid integration
Heterogeneous integration
MATERIAL INTERFACING METHODS
Grating coupling
Mirror coupling
Adiabatic tapers
INTEGRATION METHODS
Flip-chip integration
Transfer printing
Die and wafer bonding
Layer deposition
Direct growth
HYBRID AND HETEROGENEOUS INTEGRATION EXAMPLES FOR REAL WORLD APPLICATIONS
Transceivers
Integrated optical gyroscopes
Optical frequency synthesizer
FUTURE DIRECTIONS
VIII. CONCLUSION

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