Abstract

Thermal interface materials (TIMs) are extensively used in electronic devices as efficient heat transfer materials. We fabricated all-carbon TIMs by hybridizing single-wall carbon nanotubes (SWCNTs) with graphite and demonstrated their performance by applying them to a thermoelectric generator (TEG) device. The hybrid carbon TIM exhibited maximum thermal conductivity when the SWCNT content was near 10 wt%. The TIM thermal contact resistance measured by a home-made calorimeter setup was 2.19 × 10−4 m2K/W, which did not vary with temperature but decreased with applied pressure. Post-treatment of the TIM with a silane coupling agent further reduced the TIM thermal contact resistance by 30%. When the TIM was placed between a TEG device and a copper heat reservoir, the TEG output power increased with the temperature difference across the TEG and applied pressure. Moreover, the post-treatment of the TIM enhanced the output power of the TEG device by up to 18.5%. This work provides a simple and effective pathway towards a carbon-based TIM that can be applied to a high temperature TEG.

Highlights

  • In this work, we fabricated all-carbon thermal interface material (TIM) by hybridizing single-wall carbon nanotubes (SWCNTs) with graphite and investigated their thermal transport properties using a laser flash method and a home-made calorimeter setup

  • The hybridization of SWCNTs with graphite showed the most synergistic effect on thermal conductivity when the SWCNT content was near 10 wt%

  • The thermal contact resistance of the TIM placed between two aluminum nitride (AlN) plates was 2.19 × 10–4 m2K/W

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Summary

Introduction

We fabricated all-carbon TIMs by hybridizing single-wall carbon nanotubes (SWCNTs) with graphite and investigated their thermal transport properties using a laser flash method and a home-made calorimeter setup. The optimal TIM composition for the maximum thermal conductivity was determined. The thermal contact resistance of the TIM was characterized as a function of the temperature and applied pressure across the TIM. The TIM was evaluated through the output performance of a TEG device with a TIM placed between the TEG device and a copper (Cu) block. We demonstrated a post-treatment method that improved the performance of the TEG device by further reducing the TIM thermal contact resistance

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