Hot Ta filament resistance in-situ monitoring under silane containing atmosphere

Abstract

Monitoring of the electrical resistance of the Ta catalyst during the hot wire chemical vapor deposition (HWCVD) of thin silicon films gives information about filament condition. Using Ta filaments for silane decomposition not only the well known strong changes at the cold ends, but also changes of the central part of the filament were observed. Three different phenomena can be distinguished: silicide (stoichiometric Ta X Si Y alloys) growth on the filament surfaces, diffusion of Si into the Ta filament and thick silicon deposits (TSD) formation on the filament surface. The formation of different tantalum silicides on the surface as well as the in-diffusion of silicon increase the filament resistance, while the TSDs form additional electrical current channels and that result in a decrease of the filament resistance. Thus, the filament resistance behaviour during ageing is the result of the competition between these two processes.