Hot Embossing of polymers – A review

Abstract

Nowadays, the demand of micro-components is steadily on the rise so that it is becoming increasingly necessary to develop a process, which can manufacture the micro-component with less cost and time. In terms of cost and time Hot Embossing is the best replication technique for the manufacturing of micro-component on a mass scale. In the Hot Embossing, mostly polymers like PMMA, PC, etc. are mainly used as the work material. These replicated structures have a wide range of applications in MEMS. In single-stage hot embossing the parameters which are considered are: applied pressure, heating temperature, embossing time, and demolding temperature. The major important process parameters studied in case of Roller Hot Embossing are roller speed, roller temperature, and applied pressure. Most of the researchers tried to achieve good replication accuracy of embossed parts by varying the process parameters. The present paper aims at reviewing the work carried out in hot embossing process, different modified setups of the hot embossing process, hot embossing of different thermoplastic polymers, and simulation of hot embossing process. The papers discussed in the present review covers research work published in the past 20 years. This review papers aims at providing as consolidated source for all the research work carried out in Hot Embossing and is expected to be a help for any researcher who is new to the field. Through this paper the wiling researcher will be able to get an overview of the type of research work that has already been carried out in the field of Hot Embossing.