Abstract
This research is sponsored: - by the Portugal Incentive System for Research and Technological Development. Project in co - promotion no 36265/2013 (Project HMIExcel - 2013 - 2015), and - by FCT with the reference project UID/EEA/04436/2013, by FEDER funds through the COMPETE 2020 – Programa Operacional Competitividade e Internacionalizacao (POCI) with the reference project POCI - 01 - 0145 - FEDER - 006941
Highlights
One of the aims of the microelectronics field is the performance and reliability improvement [1]
The key thermomechanical properties required to estimate the warpage of a PCB are the Young modulus (E), shear modulus (G), bulk modulus (K), Poisson ratio (ν) and the coefficient of thermal expansion (α)
This homogenization method takes into account the calculation of equivalent properties but the characteristics of the elastic moduli matrix as well
Summary
One of the aims of the microelectronics field is the performance and reliability improvement [1]. Owed to the attempt of manufacturing lighter and thinner components the warpage phenomena became more noticeable. They have the same elastic property values in every direction [6]. FR4 is an orthotropic material, i.e. it has three mutually perpendicular planes of elastic symmetry [7]. The key thermomechanical properties required to estimate the warpage of a PCB are the Young modulus (E), shear modulus (G), bulk modulus (K), Poisson ratio (ν) and the coefficient of thermal expansion (α). These properties fully define the materials’ thermoelastic behaviour
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