High-throughput characterization of mechanical parameters of thin-film array

Abstract

The thin-film array is a typical multi-film structure in material genetic engineering. With the requirements for rapid and efficient characterization of new film materials, a high-throughput characterization method based on digital image correlation for mapping the film elastic modulus and Poisson’s ratio of thin-film arrays is developed. First, a high-throughput experimental structure and testing system for the film array are designed, from which we can load 10 × 10 circular film arrays in the range of 0–25 kPa and obtain the full-field bulging displacement. Then, the experimental results are combined with the surface wave velocity equation to decouple the elastic modulus and Poisson’s ratio of the film array. The results are consistent with the material manual parameters, which verifies the feasibility of the high-throughput test method proposed in this article. When the method in this paper is applied to gradient materials, high-throughput testing of the mechanical parameters of a variety of film materials can be achieved. The results show that this method is valuable for quick, reliable and high-throughput determination of the film elastic modulus and Poisson’s ratio in material genetic engineering.