Abstract
AbstractFlexible memory devices are one of the most crucial elements in the wearable electronics. In this work, polyimides (PIs)‐based flexible resistive memory devices with an excellent thermal and mechanical durability are demonstrated. Four kinds of functional PIs are derived from the heterocyclic diamines including 2,6‐diaminodibenzo‐p‐dioxin (OODA) and 2,6‐diaminothianthrene, and dianhydrides including 4,4′‐(hexafluoroisopropylidene)diphthalic anhydride (6FDA) and 3,3′,4,4′‐biphenyltetracarboxylic dianhydride. PI with diamine of OODA and dianhydride of 6FDA (PI(OODA_6FDA)) possesses outstanding thermal and mechanical properties with a high glass transition temperature of 352 °C, a low coefficient of thermal expansion of 28.1 ppm K−1, and a high elongation at break of 10%. In addition, PI(OODA_6FDA)‐based memory shows write‐once‐read‐many behavior with a high on/off current ratio of 106 and a stable data retention, attributed to the donor–acceptor charge transfer between the polymer chains. The retained current levels at a low resistive state can be observed even with thermal treatment at 200 °C for 24 h or 1000 times cyclic bending at a bending radius of 5 mm. These results demonstrate the potential of heterocyclic PIs for flexible resistive memory.
Published Version
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call