Highly textured and twinned Cu films fabricated by pulsed electrodeposition

Abstract

This paper reports the influence of substrates and peak current densities on: crystallographic textures; twin density, thickness, spacing and twin boundary orientations; and electrical transport and mechanical properties of Cu films fabricated by pulsed electrodeposition. Films of {311}, {100}, {110} and {111} out-of-plane textured Cu with a high density of {111} twins were synthesized. With increasing twin density and change of texture by selection of the peak current densities and substrates, the ultimate tensile strength, hardness and elongation monotonically increase. This paper also discusses the mechanisms for manipulation of texture and twin densities via changing both the peak current densities and substrates, and the correlation among the microstructure, electrical resistivity and mechanical properties.