HIGHLY SCALED CMOS DEVICE TECHNOLOGIES WITH NEW STRUCTURES AND NEW MATERIALS

Abstract

In this paper field effect transistors (FETs) with new materials and new structures are discussed. A thermal robust HfN/HfO 2 gate stack, which can alleviate the confliction between high quality high k material and low EOT, is investigated. EOT of the gate stack can be scaled down to 0.65nm for MOS capacitor and 0.95nm for MOSFET with higher carrier mobility. A new dual metal gate/high k CMOS integration process was demonstrated based on a dummy HfN technique for better high k quality and metal gate integration. Several new double gate FETs are proposed and investigated, including vertical double gate device with an asymmetric graded lightly doped drain (AGLDD) for better short channel behavior, self-aligned electrically separable double gate device for dynamic threshold voltage operation, new 3-D CMOS inverter based on double gate structure and SOI substrate for compact configuration and new full-symmetric DGJFET for 10nm era with greatly relaxed requirement of silicon film thickness and device design simplification.