Abstract
Radio Frequency (RF) modules have been miniaturized to meet the demand for smaller and more enhanced handsets for wireless applications such as cellular phones. However, area for passive devices used in RF modules has made further miniaturization difficult. Passives embedded in substrates are now being studied intensively. In addition, circuit simulation technology has been developed that enables efficient designing of RF module circuits. Circuit designers, however, have limited database of organic substrates and embedded passives. Further, optimized thermal designs are required to prevent thermal resistance increase due to miniaturization of substrates. In this paper, we describe the high-frequency properties of the capacitors embedded in the organic substrates and present the equivalent circuit models of the embedded capacitors. We also present the thermal design of organic substrates applicable to RF modules.
Highlights
Radio Frequency (RF) modules have been miniaturized to meet the demand for smaller and more enhanced handsets for wireless applications such as cellular phones
We describe high-frequency properties of capacitors embedded in organic substrates and present equivalent circuit model of embedded capacitors
We present the thermal design of organic substrates applicable to RF modules
Summary
Radio Frequency (RF) modules have been miniaturized to meet the demand for smaller and more enhanced handsets for wireless applications such as cellular phones. Smaller semiconductor devices and passives have been usually used for the miniaturization of modules, but it is sometimes required to embed passives into substrates for further miniaturization. The simulation is becoming more important to improve the efficiency of R&D. The information on the electrical properties and the circuit design of organic substrates are so poor that the efficient usage of organic substrates is difficult for designers. We describe high-frequency properties of capacitors embedded in organic substrates and present equivalent circuit model of embedded capacitors. We present the thermal design of organic substrates applicable to RF modules
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