Abstract

We report and detail a lithography-free method to pattern Si substrates. In particular, a focused Ga ion beam is used to create regular patterns of holes which serve as a template for the growth of vertically aligned GaAs nanowires (NW)s on Si(111) substrates using self-catalyzed molecular beam epitaxy. We show that the hole diameter plays a crucial role in the growth of the NWs at the drilled holes. The critical parameters defining the width of the holes are: ion dose quantities, wet etching procedures, and high-temperature steps at the process of growth. As a result, we obtained a yield of more than 80% for vertically aligned NW. Compared to other methods of patterning our approach provides the following advantages: (i) it is a lithography-free procedure, (ii) allows for quick patterning process and hole diameter optimization within a small window of trial and error, (iii) and provides potential applicability for different material systems.

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