High Volume, Low Cost Multi Die Packaging Using Conductive Polymer Interconnect

Abstract

Wire bonding multiple die in a single package, PoP (Package on Package) and, more recently, TSV (thru silicon via) approaches are often considered for small, portable consumer electronic devices. Conductive polymer interconnect is a new approach that provides cost and size advantages for a wide variety of applications. Conductive filled polymer materials are well suited for chip to package and chip to chip interconnect. They are compatible with existing equipment and material sets used in a typical semiconductor assembly facility, and capital costs for adding this capability are relatively low. This method also offers size and cost advantages for single die packaging of image sensors and other die, where there is a requirement to connect to the front side of a die from the backside, without occluding the front surface. Wafer level packaging (WLP) methods and array processing greatly reduce costs, making the technology competitive with traditional wire bond techniques.