High thermally conductive PLA based composites with tailored hybrid network of hexagonal boron nitride and graphene nanoplatelets

Abstract

Bio‐based polymers and multifunctional polymeric composites are promising for the development of new environmentally sustainable materials and are becoming increasingly popular compared to their oil based counterparts. This research aims to develop new multifunctional bio‐based polymer composites with improved thermal conductivity and tailored electrical properties to be used as heat management materials in the electronics industry. A series of parametric studies were conducted to clarify the science behind the hybrid composites' behavior and their structure‐to‐property relationships. Using bio‐based polymers [e.g., polylactic acid (PLA)] as the matrix, heat transfer networks were developed and structured by embedding hexagonal boron nitride (hBN) and graphene nanoplatelets (GNP) in a PLA matrix. The effects of random uniform thermal hybrid networks of hBN‐GNP on improving the effective thermal conductivity (keff) of produced composites were studied and compared. Composites were characterized with respect to physical, thermal, electrical, and mechanical properties for practical application in the electronics industry. The use of high thermally conductive hybrid filler systems, with optimized filler content, was found to promote the composites' effective thermal conductivity to more than 12 times over neat PLA. The thermally conductive composite is expected to provide unique opportunities to injection mold three‐dimensional, net‐shape, lightweight, and eco‐friendly microelectronic enclosures with superior heat dissipation performance. POLYM. COMPOS., 37:2196–2205, 2016. © 2015 Society of Plastics Engineers