High temperature stability of H-diamond high frequency MOSFET with 300°C grown Al2O3 dielectric

Abstract

The high frequency H-diamond metal-oxide-semiconductor field effect transistors (MOSFETs) were fabricated on single diamond substrate using 300°C ALD grown Al2O3 as gate dielectric and passivation layer. The devices gate length, gate/drain spacing and dielectric thickness are 100 nm, 2 μm, and 10 nm, respectively. The direct-current and frequency characteristics were investigated. The device shows a maximum saturation drain current of −492.6 mA/mm and gm of 135.2 mS/mm. The device shows good high temperature working performance, and the maximum saturation drain current only has a little decreasing of 7.6%. at 200°C. In addition, the device exhibits a maximum cut-off frequency of 36.2 GHz and maximum oscillation frequency of 70.5 GHz. The transient drain current response measurement indicates that the drain current can follow the changing of gate voltage at the frequency of 1 MHz. These results indicate that the Al2O3 dielectric is suitable for using in high frequency or the high-speed switching devices.