High Temperature microhardness of hard coatings produced by physical and chemical vapor deposition

Abstract

The microhardness of hard coatings of TiN and HfN prepared by chemical vapor deposition (CVD) and TiN, HfN, ZrN and TiAlN prepared by physical vapor deposition (PVD) were measured between room temperature and 1000°C. The microhardness of the PVD coatings was significantly higher than that of the CVD counterparts at room temperature but all microhardness values tended to converge at 1000°C. Higher N: Ti ratios were found in PVD TiN relative to CVD TiN. X-ray diffraction measurements indicated that the PVD coatings contained high residual compressive growth stresses associated with lattice distortion and very fine grain size, which were confirmed using transmission electron microscopy. Low residual stresses in high temperature CVD coatings are caused by thermal expansion mismatch between coating and substrate. Differences in grain morphology and crystal texture are attributed to varying conditions of energetic bombardment and deposition temperature in the several PVD methods employed. The faster decrease in microhardness with temperature in PVD coatings is caused by the high residual energy and finer grain size.