Abstract
Ceramic technologies, especially LTCC (Low Temperature Co-fired Ceramics), offer a reliable platform to build highly stable and reliable sensors and packages, possible for application in harsh environment such as high temperature, high pressure, aggressive media and space. LTCC allows also to fabricate resistors, capacitors, inductors, heaters and many other passive components buried within ceramic substrate. In this paper package for SiC-based hydrogen sensor is presented. Heater located inside package heats the gas sensor whereas temperature sensor allows to control current temperature. Moreover package enables electric connection between SiC-based sensor and outside contacts. It also protects wire connection against mechanical destruction. The temperature field distribution was simulated. Moreover, the effect of pulse temperature changes and long-term ageing on electrical parameters of heater were investigated. Basic electrical parameters of integrated heater as well as temperature field distribution on sensor surface were presented, too.
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