Abstract
The main objective of the paper is presentation of challenges in technological aspect of manufacturing conductive paths on LTCC (low temperature co-fired ceramics) substrates. The effects of research are presented basing on the example of high resolution 3D antennas for sub-THz scanner performed using LTCC technology. The impact of screen preparation and printing conditions (the angle and pressure of squeegee, the mesh size) as well as deformations and shrinkage of the structure during co-firing, on the obtainment of desired pattern dimensions, is discussed.
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