Abstract

For the first time, a high-performance (τPGM = 200 ns/τERS = 5 ms) cell with superior reliability characteristics is demonstrated in a nor-type architecture, using dynamic-threshold source-side injection (DTSSI) in a wrapped select-gate silicon-oxide-nitride-oxide-silicon memory device, with multilevel and 2-bit/cell operation. Using DTSSI enables easy extraction of the multilevel states with a tight VTH distribution, a nearly negligible second-bit effect, superior endurance characteristics, and good data retention.

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