Abstract
The high heat flux density of modern chips presents a major challenge to their development. Single-phase or two-phase flow heat dissipation techniques using high thermal conductivity materials are seen as a potential solution. However, creating microfluidic channels from ultra-high thermal conductivity diamond materials is a significant challenge. In this paper, we present an experimental study on the fabrication of diamond heat sinks with high aspect ratio microchannels using a UV-nanosecond laser processing system, along with two multi-feed processing techniques for the collecting grooves and microchannels. We used a 1 μm spacing grid path combined with a polished multi-feed process to fabricate a 1600 μm deep collecting groove with a smooth bottom morphology. We also proposed a multi-area multi-feed fabrication technique for microchannels with an aspect ratio of 8:1 and a depth of 1600 μm. Finally, we have successfully fabricated a diamond straight microchannels heat sink, featuring a high aspect ratio and low phase change damage.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
