High purity copper nanoparticles via sonoelectrochemical approach

Abstract

Synthesis of monodisperse, uniform sized and high purity copper nanoparticles has always been difficult due to copper’s tendency for oxidation. The objective of this work to describes the synthesization of copper nanoparticles with high purity at different potentials and different current densities at fixed potential by ultrasonic electroplating (sonoelectrochemical) approach. Effects of sonication parameters such as sonication power, duty cycle and ultrasonic pulse time are also investigated. It has been observed that size and morphology of the copper nanoparticles (Cu NPs) are very closely related with deposition potential, current density at fixed potential. Sonication power, duty cycle and ultrasonic pulse time also influence the particles morphology and sizes. Copper powders having particles with uniform morphology were obtained at deposition potential −2V by sonoelectrochemical approach using amperometric I-t curve technique. Poly (vinylpyrrolidone) (PVP) was used as capping agent. The role of PVP in reducing the particle size and against oxidation is demonstrated by some important techniques. This facile synthetic process can be useful to fabricate copper nanoparticles with high purity in order to explore its true potentials and applications in nano-regime scale.