Abstract
The high power light emitting diodes unit internal structure was elaborated from materials and tooling point of view, the unit matrix frame layout for mass production was presented for copper sheet stamping. The tooling stations were decomposed and optimized for packaging processes. The optical lens body molding cavity layout was proposed for unit matrix transfer molding. The packaging materials and tooling was analyzed from the materials processes and automatic stamping & transfer molding. Design scheme for packaging materials processes can be referenced for high power LED unit devices.
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