Abstract
The need for high thermal performance semiconductor packages, such as lidded Flip Chip ball grid arrays (FCBGAs), is increasing for the next high-end central processing unit (CPU) semiconductor devices. However, today’s major polymer thermal interface materials (TIMs) have limited thermal conductivity. Also, because the polymer TIMs are located between the heat spreader (metal lid) and device die backside in the lidded FCBGA structure, assembly quality is critical to achieve low thermal contact resistance for high thermal dissipation performance. Therefore, optimal TIM selection is essential for enhanced thermal performance at the package level. In this paper, advanced TIMs are discussed for next-generation FCBGAs, specifically, TIM1 for large body and die sizes including a 2.5D multi-chip module (MCM).
Published Version
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