Abstract

We have demonstrated a high performance Si 1− x Ge x pMOSFET technology for low power circuit applications. The incorporation of 30% Ge in the strained Si 1− x Ge x channel provides a drive current enhancement by a factor of 2.7 over its counterpart Si bulk pMOSFETs and manifests a marked advantage of two decade in exponential operating region allowing both lower power consumption and a wider dynamic range for low power circuit applications. The measured low frequency noise in Si 1− x Ge x pMOSFET’s is found to be significantly lower than in Si devices. The experimental results promise the potential of SiGe/Si heterostructure MOSFETs in radio-frequency low power circuit applications.

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