Abstract
We report the fabrication of lateral pnp bipolar transistors using focused ion beam (FIB) implants of boron and phosphorus for the collector and base, respectively. The implants of B+, P+, and P++ were all at a dose of 1×1013 /cm2 and a beam voltage of 75 kV. These implants defined spaces between the emitter and collector regions of 0.5–1.50 μm; which, after diffusion and zero voltage depletion width effects were considered, produced effective on‐wafer device basewidths of ∼0.2 μm. For the best devices, values of hFE near 100 were obtained with good junction characteristics and at peak collector currents of 10 μA/μm of device width.
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