Abstract
The presence of particles less than 0.1 μm in diameter in high purity semiconductor rinse water continues to impact high density device yields. Current state-of-the-art semiconductor manufacturing deals with 0.3 μm or 0.25 μm dimensions, (1) and gate thickness in the range of 200 to 500 angstroms (2). Particles as small as one-tenth the minimum feature size can kill a device (3). Therefore the semiconductor industry requires ultrapure water free of contamination in the 0.02 μm range (4). Anthony Shucosky, Product Development Manager, Memtec America describes how this may be achieved by using a high flux 0.02 μm microporous membrane cartridge filter.
Published Version
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