Abstract
Transfer printing, a two-step process (i.e. picking up and printing) for heterogeneous integration, has been widely exploited for the fabrication of functional electronics system. To ensure a reliable process, strong adhesion for picking up and weak or no adhesion for printing are required. However, it is challenging to meet the requirements of switchable stamp adhesion. Here we introduce a simple, high fidelity process, namely tape transfer printing(TTP), enabled by chemically induced dramatic modulation in tape adhesive strength. We describe the working mechanism of the adhesion modulation that governs this process and demonstrate the method by high fidelity tape transfer printing several types of materials and devices, including Si pellets arrays, photodetector arrays, and electromyography (EMG) sensors, from their preparation substrates to various alien substrates. High fidelity tape transfer printing of components onto curvilinear surfaces is also illustrated.
Highlights
There are increasing interest and need for large scale integration of discrete multi-scale materials and components for the development of functional electronic systems
This paper explores a simple, low-cost, high fidelity transfer printing approach based on dramatic adhesive strength modulation of commercial available adhesive tape based stamps
The TTP presented in this paper represents a simple, powerful, and high fidelity approach to heterogeneously integrating materials and devices onto substrates based on adhesive strength modulation of the tape stamps
Summary
There are increasing interest and need for large scale integration of discrete multi-scale materials and components for the development of functional electronic systems. While traditional pick and place technology is not able to accomplish, transfer printing, a widely adopted approach to fabricate these high performance flexible and stretchable electronics, has proven to be a successful technology capable of heterogeneously integrating various materials, including inorganic single-crystalline dots, wires, ribbons and membranes, from a donor to a receiver substrate, such as plastic, rubber, etc[6,10,11,12,13,14,15]. To ensure successful and reliable picking up (printing), high (low) adhesive strength between stamp/ink is favorable. This paper explores a simple, low-cost, high fidelity transfer printing approach based on dramatic adhesive strength modulation of commercial available adhesive tape based stamps. High fidelity transfer printing of inks onto curvilinear surfaces is illustrated, where bare success can be achieved through conventional bulk PDMS stamps
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