Abstract
In loose-abrasive machining, a new polishing technique is required to be developed in order to finish a fragile workpiece such as thin silicon wafer or Low-k material and a hard material such as single-crystal SiC or sapphire. Namely, it is very difficult that high finishing efficiency is obtained in the above finishing using the conventional polishing technique. Then this paper deals with the achievement of high efficient finishing by using a structure-controlled polishing pad, which consists of a soft layer and a hard layer. The structure is thought to make the contact area between pad and workpiece expand with high polishing pressure. So it is expected to increase the number of the effective abrasives and the removal volume by a single abrasive. As a result of introducing it for finishing optical glass, high efficient finishing with lower load on workpiece was achieved, as compared with the conventional pads.
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